ELPEPCB Via Hole Fillers and Plugging Pastes

ELPEPCB Via Hole Fillers

Securely seal via holes for vacuum adaptation during in circuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes.

SD 2361 series

1-pack system, 100% solids content means no volume shrinkage.

• Application by screen printing
• Thixotropic adjustment suitable for large vias (approx. 0.5–1 mm).
• Excellent solder bath resistance, including lead-free solder processes.
• Resistant in electroless tin baths
• Excellent E-corrosion resistance
• UL 94 V-0 (UL file no. E80315)
• Passes ASTM E595 (outgassing test recognized by NASA)

Elpemer VF 2467 DG

Photoimageable 2-pack via hole filler compatible with Elpemer 2467 solder resist series

• Screen printable, photoimageable, aqueous-alkaline developable.
• Compatible with solder resists of the ELPEMER® 2467 series.
• UL Flame class UL94 V-0.

SD 2768 NB

High solids content designed for via-in-pad applications, no bleeding on gold or other metal surfaces, low volume shrinkage.

• Epoxy resin base, applied by screen printing.
• Excellent solder bath resistance, including lead-free solder processes.
• Good resistance to electroless/electroplating baths.
• Ink film almost insoluble after curing.
• UL flame class UL 94 V-0.

ELPEPCB Plugging Pastes

Bubble-free, smooth hole plugs/insulation layers in HDI/SBU technology, application by screen and stencil printing and vacuum screen printing, excellent platability, low thermal expansion coefficient, no cracking or delamination of the applied metallization.

PP 2795 series

• Application by means of screen and stencil printing, vacuum plugging or roller coating.
• Higher aspect ratios possible with high-viscosity adjustment.
• Long shelf life: up to 6 months.
• Solvent-free 1-pack systems with long processing time.
• Pluggable diameters of approx. 0.1 to 2 mm (PP 2795 SD: approx. 0.3 to 2 mm).
• Extremely low volume shrinkage, no “dish down”.
• No cracking or delamination of the metallized layer applied.
• Good adhesion, good machinability.
• UL 94 V-0.
• Passes ASTM E595 (outgassing test recognized by NASA).
• PP 2795 and PP 2795 SD: listed in the NASA specification D-8208 “Spacecraft Design and Fabrication Requirements for Electronic Packaging and Cabling; Section 3.6, Printed Wiring Boards; Table 3.6-5: Acceptable Via Hole-Fill Material”.
• Also available in cartridges.