Ultra-low Loss, Highly Heat Resistant Circuit Board Materials
Designed for high-speed communication network equipment such as routers and switches, MEGTRON 8 multi-layer circuit board material features the industry’s lowest transmission loss. This contributes to larger capacity and higher-speed data communication and may reduce power consumption because of the lower transmission loss.
The MEGTRON 8 family supports 800GbE used for next-generation high-speed communication technology and offers about a 30% improvement in transmission loss compared to MEGTRON 7.
For more info, contact
Rick Lovelady
Phone (714) 825-0404 ext.2123
Supply Partner: Panasonic
Part Numbers
| Ultra-Low Df Glass Cloth Type | Low Dk Glass Cloth Type | |
|---|---|---|
| Laminate | R-5795(U) | R-5795(N) |
| Prepreg | R-5690(U) | R-5690(N) |
Features
- Ultra Low Transmission Loss: Dk = 3.1 @ 14GHz, Df = 0.0012 @ 14GHz
- High heat resistance and reliability, applicable for high-layer count (20+) circuit boards
Test method used for Tg: DMA; Td: TGA; Dk and Df @ 14GHz
Frequency Dependence by Transmission Loss
General Properties
| Item | Test Method | Condition | Unit | R-5795(U) | R-5795(N) | |
|---|---|---|---|---|---|---|
| Glass Transition Temp (Tg) | DMA | A | °C | 220 | 220 | |
| CTE z-axis | α1 | IPC-TM650 2.4.24 | A | ppm/°C | 50 | 50 |
| α2 | 270 | 270 | ||||
| T288 (with copper) | IPC-TM650 2.4.24.1 | A | min | >120 | >120 | |
| Dielectric Constant (Dk) | 14GHz | Balanced-type Circular Disk Resonator |
C-24/23/50 | – | 3.1 | 3.1 |
| Dissipation Factor (Df) | 0.0012 | 0.0016 | ||||
| Peel Strength | 1oz (35µm) | IPC-TM650 2.4.8 | A | kN/m | 0.7 [H-VLP3] | 0.7 [H-VLP3] |
