High Reliability, High Tg, FR-4 Multilayer Material
KB-6167F is specifically formulated to withstand increasingly stringent demands of high complexity, high layer, lead-free PCB designs and applications.
This high Tg, multi-functional phenolic cured resin system with inorganic fillers result in high performing PCB structures.
KB-6167F offers very high heat resistance. It is particularly well-suited for lead-free soldering processes.
Supply Partner: Kingboard