Felios Flex

FELIOS

Adhesiveless Flexible Laminates

Panasonic Felios is the ideal choice for technically advanced multi-layer, rigid-flex, double and single-sided applications. Felios Flex is an engineered, all polyimide substrate with premium copper foil bonded on either one or two sides.

For more info, contact

Robert Berg

Robert Berg

Supply Partner: Panasonic

Felios Flex Rolls

R-F775/770 Product Line

RA Copper Foil

Copper Foil Thickness Film Thickness
oz µm 0.5 mil
.013 mm		 1 mil
.025 mm		 2 mils
.05 mm		 3 mils
.075 mm		 4 mils
.1 mm		 5 mils
.125 mm		 6 mils
.15 mm
1/4 9 – – –
1/3 12 – –
1/2 18
1 35
2 70 –

ED Copper Foil

Copper Foil Thickness Film Thickness
oz µm 0.5 mil
.013 mm		 1 mil
.025 mm		 2 mils
.05 mm		 3 mils
.075 mm		 4 mils
.1 mm		 5 mils
.125 mm		 6 mils
.15 mm
– 2 – –
1/6 6 – – – –
1/4 9
1/3 12
1/2 18
1 35 –
Notes
  1. High flexibility HA copper foil available in 12 and 18µm thickness for 0.5, 1.0, and 2.0 mil polyimide film thickness.
  2. Mixed copper weights available under special order with some restrictions. Generally H/1, H/2, and 1/2 are standard items.
  3. Rolls available for most constructions (10″, 12″, 19.7″, 24″)

Standard Product Line Features

  • Thin Flexible Circuit Board Materials with a low modulus polyimide
  • Segment leading dimensional stability and thermal performance (R-F775)
  • Halogen-free (Adhesiveless)
  • Polyimide Thickness available: 12.5µm – 150µm (0.5-6 mil)
  • Copper Foil: 9-70µm RA (1/4 -2 oz), 2-35µm ED (2µm – 1 oz)
  • Mil-spec approved and passes NASA outgassing specification
  • Standard panel sizes: 18×12"G, 18×24"G, 24×36"G. Rolls and custom panel sizes available.
  • Conforms to IPC 4204/11 specifications; UL 94V0, RoHS, and REACH compliant.

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