Dexerials D5410P – Low Loss Bonding Adhesive for Flexible Circuits
Dexerials D5410P is a specialty low loss bonding adhesive developed for the LCP flex and traditional adhesiveless polyimide flex circuit designs. It is a replacement for the Panasonic Felios R-BM17 product.
Dexerials D5410P has low Dk, Df, and ultra-low moisture absorption specifications that enhance the signal integrity performance of a pure package LCP and traditional polyimide flex designs.
Dexerials D5410P is multilayer flex process friendly that requires lamination processes similar to Modified acrylic and epoxy based coverlay and bond-ply materials.
- Offered as a 25µm (1 mil) free form adhesive sheet. Can be used in multiple plies to build thickness.
- Excellent adhesion and flow properties using standard flex manufacturing tools and processes.
- Fully compatible replacement for Panasonic R-BM17 adhesive offering improved peel adhesion and flow properties.
- Replaces difficult to use low melting point LCP bond plies and laminates in a very traditional polyimide flex type coverlay and bond-ply process.
- Low moisture and UL94 VTM – 0 flammability classification.
- Dexerials D5410-P materials is offered in 25µm thickness (0.001″) and in 500mm x 100M rolls (19.7″ x 328′) and panels. Country of Origin – Japan
For more info, contact
Robert Berg
bob.berg@matrixusa.us
Supply Partner: Panasonic
Dexerials D5410P Specifications and Comparison with Panasonic Felios R-BM17
| Properties | Unit | Condition | R-BM17 | D5410P | |
|---|---|---|---|---|---|
| Peel Strength | between LCP single side FCCL/BS | N/mm | 90° | 0.20 | 0.66 |
| between LCP double side FCCL/B* | 1.19 | 1.40 | |||
| between Cu/BS | 1.22 | 1.90 | |||
| Soldering Resistance | between LCP single side FCCL/BS | Limited Temp °C @ 60sec/float | As it is | 260°C pass | 260°C pass |
| C96/40/90 | 250°C | 260°C pass | |||
| between LCP single side FCCL/BS* | As it is | 260°C pass | 260°C pass | ||
| C96/40/90 | 260°C pass | 260°C pass | |||
| between Cu/BS | As it is | 260°C pass | 260°C pass | ||
| C96/40/90 | 260°C pass | 260°C pass | |||
| Dk @ 10Ghz Cavity Resonance |
– | E-2/135 | 2.22 | 2.23 | |
| C-24/23/50 | 2.22 | 2.23 | |||
| C-100/85/85 | 2.22 | 2.23 | |||
| Dfk @ 10Ghz Cavity Resonance |
– | E-2/135 | 0.0012 | 0.0014 | |
| C-24/23/50 | 0.0013 | 0.0014 | |||
| C-100/85/85 | 0.0017 | 0.0015 | |||
