Hakuto Film Lamination

Next Generation Auto Film Laminator


From the beginning of the PCB manufacturing industry in the early 1950’s, printed circuit board dry film lamination has been implemented by applying pressure to the end shafts of heated rubber rollers. The mechanical physics as shown demonstrates how there is uneven pressure across the surface of the film lamination with increasing lower pressure and lower heat toward the center of the board.

As electronic circuit packages became miniaturized, their connection leads moved to 50 mil pitch and smaller – requiring the resulting PCB traces and spaces to reach sub 0.005″ size. This uneven pressure phenomenon across the surface of the PCB can ultimately cause faulty image transfer resulting in open circuit defects on the final etched layer further resulting in an entire panel being scrapped. To deal with this new dry film precision requirement (sub 5 mil features), the industry has tried many modifications; heavy duty rolls, cantilevered pressures mechanisms, and wet lamination.

The uneven pressure situation has now been solved by utilizing a new mechanical concept whereby a heavy barrel type roller transfers pressure onto a common rubber roller with remarkable consistency for both pressure and temperature.

For more info, contact

Fred Long

Fred Long

Mobile (416) 569-8800

Supply Partner: Hakuto

Hakuto Mach6630np


  • Easy Lamination Roll Exchange
  • Easy Maintenance
  • New Pressure and Temperature Uniformity Module
  • New Enclosure for Clean Operation
  • ECO Take-up Roll for Easy Mylar Removal
  • Touch-screeen PLC Panel Control

Laminator Features and Options

  Mach 630Np Mach 660Np
Easy Lamination Roll Exchange S S
Easy Maintenance S S
EVEN Pressure Uniformity Module S S
EVEN Temperature Uniformity Module S S
Full Enclosure for Clean Operation S S
Touch Screen PLC Control S S
ECO Take-up Roll for Easy Mylar Removal S S
Cartridge Film Loading System O S
Exit Panel Temperature Monitoring O S
Dry Film Usage and End Warning Indicators O S
Ultra Thin Transport O O
Mach Prolog Software (Custom Request) O O

S = Standard Feature | O = Optional Feature