Electrostatic Panel Cleaning
The most versatile and Cost-effective Panel Cleaner
Cleanliness plays a significant role in PCB manufacturing success. Due to the continuing miniaturization of circuit features, it is now essential that dust, dirt, and human touch be eliminated from the process.
Matrix is introducing the latest Panel Cleaning device for the removal of loose surface debris using “NO-Touch” Electrostatic Neutralizers and High Pressure Air Knives… including options for vacuum particle removal.
Supply Partner: ElectroStatics
Features
- No consumables
- Robust design to last > 15-20 years
- Electrostatic Touchless Cleaning
- Consistent cleaning on every panel
- Panel Thickness: 0.001″ to 0.500″
- Minimal Maintenance
- Self Installation
- Options for particle removal
Applications
- Copper Layers and Panels before Dry Film
- Dry Film before Exposure or Direct Imaging
- Panels before and after Solder Mask
- Thin Films: PTFE, Foils, Pyralux, Flex
- Before AOI
- Prepreg before Packaging or Layup
- Copper Panels before Packaging or Layup
- Panels after Drilling/Deburring (removal of loose debris only)
- Finished Printed Circuit Boards before packaging
Specifications
Cleaning Components | 8 Banks of Air Jets (4 top, 4 bottom) |
4 Static Neutralizer Bars | |
4 Vacuum Dust Collection Hoods | |
Conveyor Speed | 1-100 FPM |
Dimensions | Operating Length: 42.5″, Width: 49.5″ |
Cleaning Width: 25.5″ | |
Conveyor Height: 34 – 41″ | |
Power | 120V, 60Hz |
Air | 9.3 CFM @ 40psi |
Particle Removal | 10-40 microns, depending on surface material |
Vacuum Requirement | 1300 CFM @ 6″ W.G. |
Resources
- DatasheetPDF, 280 KB