KB6165F is a filled, mid Tg, lead free compatible material that is capable of withstanding lead free reflow cycles. The primary slash sheet is IPC4101 /99. KB6165F is an ideal choice when value and quality are key requirements in a highly competitive industry.

For more info, contact

Sunil Shah

Sunil Shah

Office (714) 825-0404 ext.2121

Supply Partner: Kingboard



  • Lead-free DSC Tg > 150°C
  • Excellent thermal reliability
  • Low Z-CTE
  • Anti-CAF capability

Laminate Specs

Test method used for Tg: DSC; Dk and Df @ 1GHz