KB6165F is a filled, mid Tg, lead free compatible material that is capable of withstanding lead free reflow cycles. The primary slash sheet is IPC4101 /99. KB6165F is an ideal choice when value and quality are key requirements in a highly competitive industry.
Supply Partner: Kingboard
- Lead-free DSC Tg > 150°C
- Excellent thermal reliability
- Low Z-CTE
- Anti-CAF capability
Test method used for Tg: DSC; Dk and Df @ 1GHz
- DatasheetPDF, 391 KB