February 1, 2017
A technology change is required when imaging sub 5 mil features onto the new HSLL laminates
Our industry has just been introduced to a new and very simple machine concept with far reaching benefits for the PCB fabricator.
As circuit features continue to become smaller, we are now faced with critical Yield and Cost considerations. It is now more than ever – essential – to properly transfer HD Imaging patterns onto the new HSLL laminates with super low profile copper. Every time there is an imaging defect, one of these costly panels is scrapped.
Today – at the “Front End” of a PCB shop, most PCB fabricators have turned to Direct Imaging (DI) to change the way their PCB’s are manufactured … no more silver film, chemistry and processors, dark rooms, exposure equipment, yellow rooms, registration equipment, etc., etc.
DI productivity, accuracy, precision, and reliability have changed the way we are successful.
There is still something missing … We continue to apply Dry Film onto these new and expensive low profile copper laminates using the old conventional Dry Film Laminator concept… Introduced in the 1960’s.
When attaching, Dry Film using the physics of bending Hot Rolls, the pressure and temperature profile is variable. This is unacceptable on today’s sub 5 mil features.
Investing in an expensive DI system has been well worth the cost – but exposing these near perfect DI images onto poorly attached dry film, defeats the purpose.
Matrix has recently installed 9 NEW Hakuto Mach 630NP Series laminators into NA accounts with outstanding results. Customers are reporting a significant increase in first pass panel yield using the new and innovative Pressure and Heat Module… “You need to see the machine to understand how this new and simple technology performs.”
Another important feature is that lamination rolls can be changed in seconds.
Cost considerations for one of these new laminators, when amortized over several years and when considering the Yield savings, will become a much easier decision, and ROI is greatly increased over historically expectations.